Mitsubishi Materials – Low Alpha Copper (Cu) bathes – MULAS – for wafer plating

The MULAS Cu bathes are dedicated to semiconductor applications for wafer plating in order to produce copper pillars, micro copper pillars and RDL. Mitsubishi Materials Corp. Electronics proposes a low-alpha product range particularly adapted to the semiconductor industry. The flexibility and the reliability of their bathes offer a huge process window with the possibility to use current densities from 10 ASD to 25 ASD (up to 5.5µm/min).